Position Description

Systems Integration Engineer (Die Bond /Backend Semicon)
Job Code 14678
Division GMP TECHNOLOGIES (S) PTE LTD (EA Licence:11C3793)
Job Placement Location Singapore
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Job Description:

 

Systems & Process Engineering

  • Participation in the development of hardware and software modules of Die Bond equipment for the semiconductor processing (analysis, modelling, calculation, measurement, qualification)
  • Defining hardware and software requirements for interdisciplinary development team (mechanics, electronics, software, motion control)
  • Conduct and analyze experiments in order to identify suitable system parameters and machine production sequences
  • Optimization of the Die Bonder system with the focus on accuracy, stability and productivity
  • Development of "Die Bonding" process technologies according to customer requirements (analysis, modelling, calculation, measurement)

 

Customer Support

  • Support internal and external customers (occasional business travel)
  • Support product management on customer projects
  • Support manufacturing engineering on assembly and supplier issues

 

Requirements:

  • Degree qualified in related field such as microsystem technology, mechanical, electrical or mechatronic.
  • Field experience in mathematics, mechatronic or material science
  • Flair for practical work in the lab and with experience with measurement equipment
  • Microsoft office and programming knowledge
  • Good team player as well as initiative and independent contributor
  • Innovative, systematic and solution-oriented work approach
  • Flexible and able to work under pressure
  • Ability to present complex topics in appropriate ways for specific audiences

 

We regret that only shortlisted candidates will be notified.
 
GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Tan Wai Peng  |   Registration No: R110467

Contact Person: Tan, Wai Peng - Reg No:R1104671 (waipeng.tan@gmprecruit.com)

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