This is a R&D position within a dynamic and innovative technology development team, focusing on developing novel, low-noise, high-speed UV image sensors for next generations of wafer inspection and metrology equipment. As a member of the cutting-edge sensor R&D team, the ideal candidate will design, bring up and validate the high-speed circuit boards to characterize TDI CCD/CMOS image sensor.
Work closely with scientists in US to gain deep understanding of technology and engineering challenges of PCB circuit used for low-noise, high-speed UV image sensor systems.
Propose and develop new test boards, low noise analog circuits to meet with the requirements of advanced image sensor for metrology application, including schematic capture, PCB design, electronic circuits for FPGA from power integrity to gigabits SerDes transceiver interface.
Simulate and optimize developed electrical system to meet low noise, signal integrity requirements.
Design and execute the test plan to verify the developed electrical system/PCBA to make sure it meets the design specifications.
Collaborate with research scientist, firmware engineer, sensor designer and characterization expert to develop the sensor characterization solution and ensure flawless integration test at the subsystem and/or system level.
Hold design reviews with peers/management to show the proposed design can meet spec targets and requirements.
Work closely with and manage suppliers to ensure all design requirements are specified and achieved.
Master's level degree in electrical engineering or related with at least 8 years of experience or
Doctorate (Academic) in electrical engineering or related with at least 5 years of experience
Proven track record in high speed hardware design including low noise, signal Integrity, power Integrity, power circuit design, PCB layout, system debug and validation.
Strong knowledge and experience in large scale FPGA circuit design (Xilinx UltraScale+ or Intel Stratix 10).
Experience with high-speed memory and communication interfaces such as 10-100G Ethernet, DDR and PCIe is preferred.
Proficient in schematic capture and PCB layout tools, such as AutoCAD, Altium Designer.
Experience in RTL development with HDL including coding of interfaces to external sensors, memories, communication interfaces etc. is a plus.
Hands on experience with lab equipment like logic analyzer, oscilloscope, power supply etc.
Team player with good communication skills.
We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671